JPH053136B2 - - Google Patents

Info

Publication number
JPH053136B2
JPH053136B2 JP56172689A JP17268981A JPH053136B2 JP H053136 B2 JPH053136 B2 JP H053136B2 JP 56172689 A JP56172689 A JP 56172689A JP 17268981 A JP17268981 A JP 17268981A JP H053136 B2 JPH053136 B2 JP H053136B2
Authority
JP
Japan
Prior art keywords
layer
forming
semiconductor layer
substrate
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56172689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57104261A (en
Inventor
Chen Ruo Fuan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of JPS57104261A publication Critical patent/JPS57104261A/ja
Publication of JPH053136B2 publication Critical patent/JPH053136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0231Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56172689A 1980-11-03 1981-10-27 Film transistor array and method of producing same Granted JPS57104261A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/203,219 US4331758A (en) 1980-11-03 1980-11-03 Process for the preparation of large area TFT arrays

Publications (2)

Publication Number Publication Date
JPS57104261A JPS57104261A (en) 1982-06-29
JPH053136B2 true JPH053136B2 (en]) 1993-01-14

Family

ID=22753020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56172689A Granted JPS57104261A (en) 1980-11-03 1981-10-27 Film transistor array and method of producing same

Country Status (5)

Country Link
US (1) US4331758A (en])
EP (1) EP0051397B1 (en])
JP (1) JPS57104261A (en])
CA (1) CA1161967A (en])
DE (1) DE3175715D1 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309328A (ja) * 1994-05-17 1995-11-28 Masao Kusano 収容箱

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838656A (en) * 1980-10-06 1989-06-13 Andus Corporation Transparent electrode fabrication
US4398340A (en) * 1982-04-26 1983-08-16 The United States Of America As Represented By The Secretary Of The Army Method for making thin film field effect transistors
US4461071A (en) * 1982-08-23 1984-07-24 Xerox Corporation Photolithographic process for fabricating thin film transistors
JPS5954269A (ja) * 1982-09-22 1984-03-29 Seiko Epson Corp 薄膜半導体装置
GB2140203B (en) * 1983-03-15 1987-01-14 Canon Kk Thin film transistor with wiring layer continuous with the source and drain
US5019807A (en) * 1984-07-25 1991-05-28 Staplevision, Inc. Display screen
JPH0682839B2 (ja) * 1984-08-21 1994-10-19 セイコー電子工業株式会社 表示用パネルの製造方法
US4744862A (en) * 1984-10-01 1988-05-17 Semiconductor Energy Laboratory Co., Ltd. Manufacturing methods for nonlinear semiconductor element and liquid crystal display panel using the same
US4689116A (en) * 1984-10-17 1987-08-25 L'etat Francais Represented By The Minister Of Ptt (Centre National D'etudes Des Telecommunications) Process for fabricating electronic circuits based on thin-film transistors and capacitors
JPS61276256A (ja) * 1985-05-30 1986-12-06 Fujitsu Ltd 半導体装置
JPH077828B2 (ja) * 1985-05-30 1995-01-30 富士通株式会社 半導体装置
US4680085A (en) * 1986-04-14 1987-07-14 Ovonic Imaging Systems, Inc. Method of forming thin film semiconductor devices
US4986876A (en) * 1990-05-07 1991-01-22 The United States Of America As Represented By The Secretary Of The Army Method of smoothing patterned transparent electrode stripes in thin film electroluminescent display panel manufacture
US8658478B2 (en) * 2010-09-23 2014-02-25 Advantech Global, Ltd Transistor structure for improved static control during formation of the transistor
US9374887B1 (en) * 2011-09-20 2016-06-21 Sandia Corporation Single-resonator double-negative metamaterial

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669661A (en) * 1970-03-06 1972-06-13 Westinghouse Electric Corp Method of producing thin film transistors
US4013502A (en) * 1973-06-18 1977-03-22 Texas Instruments Incorporated Stencil process for high resolution pattern replication
US4040073A (en) * 1975-08-29 1977-08-02 Westinghouse Electric Corporation Thin film transistor and display panel using the transistor
US4042854A (en) * 1975-11-21 1977-08-16 Westinghouse Electric Corporation Flat panel display device with integral thin film transistor control system
US4086127A (en) * 1977-07-01 1978-04-25 Westinghouse Electric Corporation Method of fabricating apertured deposition masks used for fabricating thin film transistors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309328A (ja) * 1994-05-17 1995-11-28 Masao Kusano 収容箱

Also Published As

Publication number Publication date
EP0051397A2 (en) 1982-05-12
EP0051397A3 (en) 1983-06-22
DE3175715D1 (en) 1987-01-22
EP0051397B1 (en) 1986-12-10
US4331758A (en) 1982-05-25
CA1161967A (en) 1984-02-07
JPS57104261A (en) 1982-06-29

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